Adhesion characterization test site

Details Adhesion characterization test site Adhesion characterization test site

1984-12-24

1986-09-23

Frankfort, Charles

Measuring and testing

Coating material: ink adhesive and/or plastic

73842, G01B 2108, G01N 308, G01N 1904

Patent

active

046128050

ABSTRACT:
A test site for gauging the adhesion between the insulating layers and the metal layers used to produce the various devices on a semiconductor chip. The chip-sized test site can be formed along with the product chips on the product wafers. The layers of the test site are arranged such that a first polyimide layer forms a first test interface with a silicon nitride layer and a second test interface with a first metal layer, and a second polyimide layer forms a third test interface with a second metal layer, a fourth test interface with the first polyimide layer, and a fifth test interface with the silicon nitride layer. These five interfaces form a single continuous adhesion test interface. During a 90.degree. peel test, the layers of the test site will sequentially separate along this interface. Thus, the adhesion at five different interfaces can be tested during a single peel test on a chip-sized test site.

REFERENCES:
patent: 3580065 (1971-05-01), Strittmater
patent: 3985597 (1976-10-01), Zielinski
patent: 4024567 (1977-05-01), Iwata et al.
patent: 4316200 (1982-02-01), Ames et al.
patent: 4365264 (1982-12-01), Mukai et al.
patent: 4367119 (1983-01-01), Logan et al.
patent: 4501154 (1985-02-01), Mori
patent: 4533935 (1985-08-01), Mochizuki
C. Altman et al., "Measuring Adhesion of Thin Films", IBM Tech. Disclosure Bulletin, vol. 12, No. 10, Mar. 1970, p. 1674.
Chang, "Testing Site for Determining Capacitances of Integrated Circuits", IBM Tech. Disclosure Bulletin, vol. 16, No. 6, Nov. 1973, pp. 1990-1992.
Lukianoff, "Testsite Layout", IBM Tech. Disclosure Bulletin, vol. 24, No. 12, May 1982, pp. 6445-6447.

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