Adhesion assisting agent-bearing metal foil, printed wiring...

Details Adhesion assisting agent-bearing metal foil, printed wiring... Adhesion assisting agent-bearing metal foil, printed wiring...

2011-01-04

2011-01-04

Lam, Cathy (Department: 1784)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C174S259000

Reexamination Certificate

active

07862889

ABSTRACT:
The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

REFERENCES:
patent: 2897186 (1959-07-01), Miller et al.
patent: 4837086 (1989-06-01), Takahashi et al.
patent: 5053280 (1991-10-01), Takanezawa et al.
patent: 5153987 (1992-10-01), Takahashi et al.
patent: 5366814 (1994-11-01), Yamanishi et al.
patent: 5389446 (1995-02-01), Yamanishi et al.
patent: 5419946 (1995-05-01), Takanezawa et al.
patent: 5622782 (1997-04-01), Poutasse et al.
patent: 5874009 (1999-02-01), Inada et al.
patent: 5935452 (1999-08-01), Inada et al.
patent: 6380633 (2002-04-01), Tsai
patent: 6748652 (2004-06-01), Andou et al.
patent: 6979712 (2005-12-01), Takanezawa et al.
patent: 7572503 (2009-08-01), Takanezawa et al.
patent: 2003/0180512 (2003-09-01), Andou et al.
patent: 1 106977 (1995-08-01), None
patent: 1358407 (2002-07-01), None
patent: 01-276789 (1989-11-01), None
patent: 04-182466 (1992-06-01), None
patent: 04-207097 (1992-07-01), None
patent: 05-057835 (1993-03-01), None
patent: 06-116517 (1994-04-01), None
patent: 06-148877 (1994-05-01), None
patent: 06-335992 (1994-12-01), None
patent: 07-221444 (1995-08-01), None
patent: 07-329246 (1995-12-01), None
patent: 09-199861 (1997-07-01), None
patent: 10-004254 (1998-01-01), None
patent: 10-242635 (1998-09-01), None
patent: 11-021419 (1999-01-01), None
patent: 11-074641 (1999-03-01), None
patent: 11-130831 (1999-05-01), None
patent: 11-214844 (1999-08-01), None
patent: 2000-256537 (2000-09-01), None
patent: 2002-003577 (2002-01-01), None
patent: 2002-012740 (2002-01-01), None
patent: 2002-084073 (2002-03-01), None
patent: 2002-137328 (2002-05-01), None
patent: 2002-226556 (2002-08-01), None
patent: 2003-158364 (2003-05-01), None
patent: 2003-198122 (2003-07-01), None
patent: 2003-229648 (2003-08-01), None
patent: 2003-264373 (2003-09-01), None
patent: 2004-014611 (2004-01-01), None
patent: 2004-025835 (2004-01-01), None
patent: 2004-047680 (2004-02-01), None
patent: 2004-250470 (2004-09-01), None
patent: 2005-053218 (2005-03-01), None
patent: WO 2005-009093 (2005-01-01), None
Japanese Official Action issued Feb. 3, 2009, for Application No. 2004-116726. (Partial translation enclosed).
Chinese Official Action issued Sep. 5, 2008, for Application No. 2005100051273.
Japanese Official Action issued Apr. 15, 2008, for Application No. 2004-024456.
Japanese Official Action issued Jun. 24, 2008, for Application No. 2004-116727.
Chinese Official Action issued Jan. 18, 2008, for Application No. 2005100051273.
Japanese Official Action (Notice of Reasons for Rejection) issued Dec. 4, 2007, for Application No. 2004-116726.
Korean Official Action issued Aug. 16, 2006, for Application No. 10-2005-7902.
First Notification of Reasons for Rejection, issued Jul. 20, 2006, in connection with counterpart Taiwanese application.
Taiwanese Official Action issued Jan. 19, 2009, for Application No. 95142602.
Taiwanese Official Action issued Apr. 19, 2009, for Application No. 95142602.
Chinese Official Action dated Apr. 24, 2009, for Application No. 2005100051273.
Japanese Official Action issued Jul. 28, 2009, for Application No. 2004-024456.
Taiwanese Official Action issued Jul. 22, 2009, for Application No. 09820445290.
Chinese Official Action issued May 26, 2010, for Application No. 200810149260.X.

Affiliated with

Also associated with

Rating

Adhesion assisting agent-bearing metal foil, printed wiring... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesion assisting agent-bearing metal foil, printed wiring..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesion assisting agent-bearing metal foil, printed wiring... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2702508