Additives process for producing plated holes in printed circuit

Details Additives process for producing plated holes in printed circuit Additives process for producing plated holes in printed circuit

1976-12-22

1977-10-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

96 351, 96 384, 156230, 156247, 156280, 156634, 156656, 156660, 156661, 156902, 427 97, 427 98, C23F 102, H05K 100

Patent

active

040544834

ABSTRACT:
An improved process for preparing printed circuit boards whereby through-holes are introduced into an element comprising a substrate, a photosensitive resist layer, and a superposed, strippable support. The through-holes are catalyzed prior to removal of the strippable support. After exposure the imaged photoresist is developed, the catalyzed-through-holes are electrolessly plated and the printed circuit is prepared using the developed image. Single sided, two or more layered printed circuit boards with plated-through-holes and interconnections can be prepared by this process.

REFERENCES:
patent: 3661576 (1972-05-01), Crary
patent: 3778900 (1973-12-01), Haining et al.
patent: 3948701 (1976-04-01), Fasbender et al.

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