Additive method for manufacturing printed circuit boards using a

Details Additive method for manufacturing printed circuit boards using a Additive method for manufacturing printed circuit boards using a

1987-04-28

1988-11-01

Morgenstern, Norman

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430314, 430319, 427 98, 427304, 427306, 427307, B05D 512, B05D 304, B05D 310

Patent

active

047820071

ABSTRACT:
An additive process for making printed circuit boards utilizing aqueous alkaline strippable resists, in which a suitable insulating substrate is patterned with the resist, the resist-patterned substrate catalyzed to electroless metal deposition, the resist then stripped completely from the substrate, utilizing an aqueous alkaline solution, preferably containing a reducing agent, and the electroless metal then deposited over the areas of the substrate catalyzed in the desired pattern.

REFERENCES:
patent: 4217182 (1980-08-01), Cross
patent: 4264646 (1981-04-01), Thornburg et al.
patent: 4388351 (1983-06-01), Sawyer
patent: 4551488 (1985-11-01), Leech et al.
patent: 4574031 (1986-03-01), Dorey, II et al.
patent: 4666739 (1987-05-01), Roubal

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