Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2001-02-12
2002-11-05
Seidleck, James J. (Department: 1711)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C522S109000, C522S111000, C522S113000, C522S120000, C522S134000, C522S143000, C522S100000, C522S170000, C430S281100, C430S286100, C430S270100, C430S288100, C428S690000, C428S901000, C428S500000
Reexamination Certificate
active
06475701
ABSTRACT:
This application claims priority to Japanese Patent Application No. 2000-34807, filed Feb. 14, 2000.
BACKGROUND OF THE INVENTION
The present invention relates to an active energy beam curable composition such as a photosensitive resin composition, which is useful for forming a patterned image through an ultraviolet exposure and a development using a dilute alkali aqueous solution, is tack-free to an exposure film for forming the patterned image, is capable of providing a pattern which is excellent in adhesivity, electric insulating property, soldering heat resistance and chemical resistance, and is suited for use as a solder resist for manufacturing a printed wiring board. The present invention also relates to a printed wiring board provided with a cured film of the active energy beam curable composition.
The printed wiring board is provided on the substrate thereof with conductive circuit patterns including soldering lands on which electronic components are mounted by means of soldering. The entire circuit patterns excluding the soldering lands are covered with a solder resist film functioning as a permanent protective film. Due to the existence of this solder resist film, a solder is prevented from being adhered to unnecessary portions on the occasion of soldering electronic parts onto the printed wiring board, and at the same time, the conductive circuits from being directly exposed to air and hence from being oxidized or eroded by moisture.
Conventionally, a thermosetting type resist is extensively employed as this solder resist, the thermosetting type resist being generally applied by way of a screen printing method. However, due to recent trend to further increase the density of wiring of the printed wiring board, the screen printing method is limited in terms of the resolution. As a result, a photo-solder resist to be used for forming a pattern by means of photographic method has been increasingly employed at present.
However, according to the conventional photo-solder resists, since a harmful organic solvent such as 1,1,1-trichloroethane is employed in the development of the resists, it is impossible to avoid the problems such as bad influence on human body, environmental pollution, etc. Meanwhile, an alkali-development type resist which is capable of being developed by making use of a weak alkali solution such as sodium carbonate solution is being developed. For example, Japanese Patent Publication H1-54390 discloses a photosensitive resin composition comprising an active energy beam curable resin to be derived from a reaction between a reaction product of novolac type epoxy resin with an unsaturated monocarboxylic acid and a saturated or unsaturated polybasic acid anhydride.
However, the photosensitive resin composition disclosed in Japanese Patent Publication H1-54390 is not only insufficient in terms of properties such as exposure sensitivity, resolution, chemical resistance, solvent resistance, but also defective in that the coated surface thereof is tacky even if it is dried by volatilizing a solvent after coating it on a printed wiring board so that when a negative film which is once contacted with the coated surface is peeled off after the exposure thereof, part of the coated film is caused to adhere to the negative film, thereby making it difficult to reuse the negative film which is designed to be repeatedly used.
BRIEF SUMMARY OF THE INVENTION
Therefore, a first object of this invention is to provide an active energy beam curable composition of alkali-development type, which is excellent in properties such as exposure sensitivity, resolution, solvent resistance, in particular very excellent in heat resistance, adhesivity and chemical resistance, and also excel lent in workability. This object also includes a printed wiring board which is provided with a cured film of such an active energy beam curable composition.
A second object of this invention is to provide an active energy beam curable composition which is useful for forming a coated film which is tack-free to an exposure film for forming a patterned image. This object also includes a printed wiring board which is provided with a cured film of such an active energy beam curable composition.
Namely, according to the present invention, there is provided (1) an active energy beam curable composition comprising;
(A) an active energy beam curable vinyl copolymer modified resin to be derived by adding an epoxy compound represented by the following general formula (4) to part of carboxylic group of a copolymer containing at least monomers represented by the following general formulas (1) and (3) among the monomers represented by the following general formulas (1), (2) and (3);
(B) an active energy beam curable bisphenol type epoxyacrylate resin;
(C) a reactive diluent;
(D) a photopolymerization initiator; and
(E) a thermosetting compound.
wherein R
1
represents hydrogen atom or an aliphatic hydrocarbon group having 1 to 6 carbon atoms; and R
2
represents hydrogen atom, hydroxyl group or alkoxyl group.
wherein R
3
represents hydrogen atom or methyl; and R
4
represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms or an aromatic group.
wherein R
5
represents hydrogen atom or methyl.
wherein R
6
represents hydrogen atom or methyl; R
7
represents an alkylene group having 1 to 12 carbon atoms or an aromatic group.
This invention further provides (2) an active energy beam curable composition according to the aforementioned item (1), wherein the active energy beam curable vinyl copolymer modified resin (A) has an average molecular weight of 5,000 to 70,000.
This invention further provides (3) an active energy beam curable composition according to the aforementioned item (1) or (2), wherein the active energy beam curable vinyl copolymer modified resin (A) has an acid value of 50 to 150.
This invention further provides (4) an active energy beam curable composition according to any one of the aforementioned item (1) to (3), wherein the ratio of the monomer represented by the general formula (1) in the copolymer is at least 20 mole %.
This invention further provides (5) an active energy beam curable composition according to any one of the aforementioned item (1) to (4), wherein the ratio added of the epoxy Compound represented by the general formula (4) to a quantity used of the monomer represented by the general formula (3) in the copolymer is in the range of 20 to 70 mole %.
This invention further provides (6) an active energy beam curable composition according to any one of the aforementioned item (1) to (5), wherein the active energy beam curable bisphenol type epoxyacrylate resin (B) is a compound to be derived by using as a reactive component a resin selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin and bisphenol S epoxy resin.
This invention further provides (7) an active energy beam curable composition according to any one of the aforementioned item (1) to (6), wherein the reactive diluent (C) is a photopolymerizable monomer, at least one kind of which is employed at a ratio of 2 to 40 g per 100 g of the active energy beam curable vinyl copolymer modified resin (A).
This invention further provides (8) an active energy beam curable composition according to any one of the aforementioned item (1) to (7), wherein at least one kind of the photopolymerization initiator (D) is employed at a ratio of 0.2 to 30 g per 100 g of the active energy beam curable vinyl copolymer modified resin (A).
This invention further provides (9) an active energy beam curable composition according to any one of the aforementioned item (1) to (8), wherein at least one kind of the thermosetting compound (E) is employed at a ratio of 5 to 100 g per 100 g of the active energy beam curable vinyl copolymer modified resin (A).
This invention further provides (10) a printed wiring board which is covered with a solder resist film constituted by a cured film of the active energy beam curable compositions according to any one of the aforementioned item (1) to (9).
DETAILED DESCRIPTION OF THE
Ito Ken
Miura Ichiro
Ohno Takao
King & Schickli PLLC
McClendon Sanza L.
Seidleck James J.
Tamura Kaken Corporation
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