Active components and photosensitive resin composition...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S325000, C430S330000

Reexamination Certificate

active

06921623

ABSTRACT:
A photosensitive resin composition for using in combination with a photosensitizer comprises an active component selected from an active metal alkoxide represented by the formula (1) or a polycondensate thereof and a particle represented by the formula (2),in-line-formulae description="In-line Formulae" end="lead"?(X)m-n-Mm-[(U1)p—(U2-Z)t]n  (1)in-line-formulae description="In-line Formulae" end="tail"?in-line-formulae description="In-line Formulae" end="lead"?P—[(Y)s—{(U1)p—(U2-Z)t}]k  (2)in-line-formulae description="In-line Formulae" end="tail"?wherein, X shows a hydrogen, a halogen, an alkoxy group or an alkoxycarbonyl group, M shows a metal atom whose valence m is not less than 2, U1shows a first connecting unit, U2shows a second connecting unit and Z shows a group causing a difference in solubility by light exposure, P shows a fine particle carrier, Y shows a coupling residue, n shows an integer of not less than 1 and m>n, p shows 0 or 1, t shows 1 or 2, k shows an integer of not less than 1, and s shows 0 or 1).The unit (U1)p—(U2-Z)t is represented by the following formula:in-line-formulae description="In-line Formulae" end="lead"?f(R1)q-(B)r]p-({(R2),,-(Ar)v}-Zltin-line-formulae description="In-line Formulae" end="tail"?(wherein, R1 and R2 show an alkylene or alkenylene group; and B shows an ester bond, an amide bond, a urea bond, a urethane bond, an imino group, a sulfur atom or a nitrogen atom; Ar represents an arylene or cycloalkylene group; each of the factors, q, r, a and v, shows 0 or 1, and q+r+u+vzl; and Z, p and t have the same meanings defined above).

REFERENCES:
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patent: 5612170 (1997-03-01), Takemura et al.
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Encapsulated Inorganic Resist Technology, Theodore H. Fedynyshyn et al, pp. 627-637.

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