Activating composition for plating of electrically insulative su

Details Activating composition for plating of electrically insulative su Activating composition for plating of electrically insulative su

1989-05-03

1992-11-24

Beck, Shrive

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

427304, 427305, 427306, C23C 2600

Patent

active

051659719

ABSTRACT:
The invention relates to an activating composition for the electroless plating of non-conductive surfaces, in particular electronic printed circuit boards.
The composition contains a metal complex in which the ligand consists of a quaternary nitrogen compound, especially a compound in which nitrogen forms part of a heterocyclic system and is quaternarized with a radical comprising an acid residue carrying a negative charge, for example a sulphonated group.
The invention also concerns a method for the electroless plating involving the use of such composition, preceded by a preliminary treatment of the substrate and followed by the reduction of activating metal.
The activating composition according to the invention allows to fix firmly the activator metal to the substrate.

REFERENCES:
patent: 2876177 (1959-03-01), Gundel
patent: 3708329 (1973-01-01), Schoenberg
patent: 3862019 (1975-01-01), Rosenberg
patent: 3940320 (1976-02-01), Kardos
patent: 4082899 (1978-04-01), Feldstein
patent: 4087586 (1978-05-01), Feldstein
patent: 4180600 (1979-12-01), Feldstein
patent: 4220678 (1980-09-01), Feldstein
patent: 4248632 (1981-02-01), Ehrich
patent: 4301196 (1981-11-01), McCormack

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