Acoustic transducer chip

Details Acoustic transducer chip Acoustic transducer chip

1996-05-03

1997-11-04

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

257416, 257735, H01L 2982

Patent

active

056843240

ABSTRACT:
A wafer and a method of making a wafer containing a plurality of severable transducer chips includes a wafer; a plurality of transducer chips formed on the wafer; and a grid of longitudinal and latitudinal grooves in the wafer for separating the chips from each other and enabling them to be easily, individually severed from the wafer, as well as a transducer chip and a method of making it, having integral raised contacts adapted for a flip chip or beam lead interconnection, with a transducer formed on the chip; and a plurality of raised contacts integrally formed with the chip and electrically interconnected with the transducer.

REFERENCES:
patent: 5103279 (1992-04-01), Gutteridge
patent: 5381300 (1995-01-01), Thomas et al.
patent: 5449626 (1995-09-01), Hezel

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