Acoustic sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Reexamination Certificate

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Details

C257S595000, C257SE31113, C257SE31124, C381S175000, C381S423000

Reexamination Certificate

active

11188800

ABSTRACT:
A sound hole is provided in a silicon substrate. A diaphragm electrode is secured to the upper surface of the silicon substrate via at least one fixed end so as to cover the sound hole of the silicon substrate. The diaphragm electrode is provided with four projections extending in respective directions of diameter orthogonal to each other. The fixed end is provided in one of the four projections. Hinge shafts are provided in the other three projections. A backplate electrode is provided above the diaphragm electrode so as to form a capacitor.

REFERENCES:
patent: 6441451 (2002-08-01), Ikeda et al.
patent: 2003/0063762 (2003-04-01), Tajima et al.
patent: 60-500841 (1985-05-01), None
patent: 2002-27595 (2002-01-01), None
patent: WO 84/03410 (1984-08-01), None
Korean Office Action dated Sep. 27, 2006, with English translation.

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