Abrading – Abrading process – With tool treating or forming
Reexamination Certificate
1999-02-16
2001-01-23
Hail, III, Joseph J. (Department: 3725)
Abrading
Abrading process
With tool treating or forming
C451S060000, C451S446000, C451S447000
Reexamination Certificate
active
06176765
ABSTRACT:
FIELD OF THE INVENTION
This invention is directed to semiconductor processing and more particularly to the collection of slurry from a chemical-mechanical polishing apparatus for sampling.
BACKGROUND OF THE INVENTION
In the semiconductor industry, chemical-mechanical polishing (CMP) is used to remove a portion of a film deposited on a wafer. In a CMP process, a film is selectively removed from a semiconductor wafer by rotating the wafer against a polishing pad (or rotating the pad against the wafer, or both) with a controlled amount of pressure in the presence of a slurry.
Monitoring and controlling the CMP process is difficult, since many different factors influence the polishing rate (e.g. rotation speed, polishing pad wear, chemical reactions between the slurry and the wafer surface, etc.). It is desirable to (1) detect when polishing should be stopped (i.e. when the process endpoint has been reached), (2) detect particles in the slurry which cause scratching, (3) detect chemical species for contamination control, and (4) understand the process chemistry. Such tasks could be performed by in-situ real time (i.e. while the wafer is being polished) slurry sampling and analysis. This requires a robust collection apparatus which is not affected by the slurry chemistry, does not interfere with the polishing, and enables sampling with a rapid response time.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide for a slurry collection system suitable for in-situ real-time slurry sampling and analysis.
Another object of the present invention is to provide for such a slurry collection system which is not affected by the slurry chemistry.
Another object of the present invention is to provide for such a slurry collection system that does not interfere with the polishing process.
Yet another object of the present invention is to provide for such a slurry collection system that enables sampling with a rapid response time.
In accordance with the above listed and other objects, a fluid collection apparatus is provided, which comprises an accumulator for contacting a polishing surface of a polishing pad and collecting fluid from the polishing pad, a reservoir for receiving fluid from the accumulator, and a volume maintainer for maintaining a set volume of fluid in the reservoir.
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Gilhooly James A.
Li Leping
Lipori Robert B.
Morgan, III Clifford O.
Surovic William J.
Anderson Jay H.
Hail III Joseph J.
Hong William
International Business Machines - Corporation
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