Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2007-08-07
2007-08-07
Garbowski, Leigh M. (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000
Reexamination Certificate
active
10876396
ABSTRACT:
In one embodiment, a level in a process technology for an integrated circuit that has dummy metal patterns is represented as a level in a process model. The level of the process model may comprise a high-k dielectric to represent the dummy metal patterns. In the level of the process model, each metal line may be surrounded by a normal dielectric. If the process technology has voids or pockets of air in between the metal lines, then each void or air pocket may be placed in a normal dielectric in the process model. Among other advantages, this allows the process model to take into account the effects of the dummy metal patterns.
REFERENCES:
patent: 5790417 (1998-08-01), Chao et al.
patent: 6037249 (2000-03-01), Chiang et al.
patent: 6243653 (2001-06-01), Findley
patent: 6381730 (2002-04-01), Chang et al.
patent: 6678879 (2004-01-01), Hawse et al.
patent: 6816999 (2004-11-01), Lee
patent: 6854100 (2005-02-01), Chuang et al.
patent: 2002/0116686 (2002-08-01), Shin et al.
patent: 2002/0144224 (2002-10-01), Frerichs et al.
patent: 2003/0229875 (2003-12-01), Smith et al.
patent: 2003/0299875 (2003-12-01), Smith et al.
patent: 2004/0158805 (2004-08-01), Kanamoto et al.
La Bouff Michael
Rekhi Sanjay
Cypress Semiconductor Corporation
Garbowski Leigh M.
Okamoto & Benedicto LLP
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