Abrasives for chemical mechanical polishing

Details Abrasives for chemical mechanical polishing Abrasives for chemical mechanical polishing

2006-08-08

2006-08-08

Chen, Kin-Chan (Department: 1765)

Compositions

Etching or brightening compositions

C438S692000

Reexamination Certificate

active

07087188

ABSTRACT:
A slurry for use in polishing a first material having a first hardness, wherein the first material overlies a second material having a second hardness, and the second hardness is greater than the first hardness, includes an abrasive that has a hardness which is greater than that of the first material but less than that of the second material. In a particular embodiment of the present invention copper overlying a copper diffusion barrier is polished with a slurry having an abrasive which is harder than copper but less hard than the copper diffusion barrier. Iron oxide, strontium titanate, apatite, dioptase, iron, brass, fluorite, hydrated iron oxide, and azurite, are examples of materials that are harder than copper but less hard than materials typically used as copper diffusion barriers in integrated circuits.

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International Search Report PCT/US 00/31913.
ROC Patent Publication No. 332895, (i.e., ROC Patent Application No. 86106082) and English Translation.

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