Abrasive composition for the integrated circuit electronics...

Details Abrasive composition for the integrated circuit electronics... Abrasive composition for the integrated circuit electronics...

2007-08-07

2007-08-07

Deo, Duy-Vu N. (Department: 1765)

Abrasive tool making process, material, or composition

With inorganic material

C051S308000, C051S309000

Reexamination Certificate

active

11594079

ABSTRACT:
Abrasive composition for the integrated circuits electronics industry comprising an aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds and an abrasive surfactant, this abrasive being for mechanical chemical polishing in the integrated circuits industry, comprising a fabric impregnated by such a composition, and a process for mechanical chemical polishing.

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