Abnormality cause specifying method, abnormality cause...

Data processing: measuring – calibrating – or testing – Measurement system – Performance or efficiency evaluation

Reexamination Certificate

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C702S035000

Reexamination Certificate

active

07599817

ABSTRACT:
A feature amount is generated by standardizing inspection data related to a fabrication unit for each type, a similar set including fabrication units corresponding to similar feature amounts is formed by comparing the feature amounts, and apparatus difference analysis is performed between a plurality of fabrication units forming the similar set. A two-level orthogonal table is used to determine whether to adopt a feature amount of each type, and some feature amounts are not used in the apparatus difference analysis and the like by optimizing the smaller-the-better characteristic or the larger-the-better characteristic of a test value of the apparatus difference analysis, thereby reducing the calculation amount and accurately and efficiently specifying an abnormality cause.

REFERENCES:
patent: 7031860 (2006-04-01), Liang et al.
patent: 7043384 (2006-05-01), Matsushita et al.
patent: 7197414 (2007-03-01), Matsushita et al.
patent: 7212952 (2007-05-01), Watanabe et al.
patent: 2003/0011376 (2003-01-01), Matsushita et al.
patent: 2004/0049722 (2004-03-01), Matsushita
patent: 2004/0255198 (2004-12-01), Matsushita et al.
patent: 2005/0021303 (2005-01-01), Matsushita et al.
patent: 2005/0194590 (2005-09-01), Matsushita et al.
patent: 2005/0251365 (2005-11-01), Matsushita et al.
patent: 2004-288743 (2004-10-01), None
English Abstract of 2004-288743, Oct. 14, 2004.
Matsushita, H. et al., “New Method of Classification System for Wafer Maps,” Proceedings of ISSM 2004, 4 Sheets, (2004).
Matsushita, H. et al., “Highly Sensitive Inspection System for Lithography-Related Faults in Agile-Fab-Detecting Algorithm for Monitoring and Evaluation of Yield Impact,” IEEE Transactions on Semiconductor Manufacturing, vol. 15, No. 14, pp. 1-7, (Nov. 2002).

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