Ablative process for printed circuit board technology

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430311, 430313, 430323, 430396, 430945, 216 65, 216 13, 216 59, 216 48, G03F 724

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054728282

ABSTRACT:
In a method for fabricating a printed circuit board on a doubly contoured or hemispherical substrate such as a radome, a coherent light source is used to form a plurality of elements of a predetermined pattern on the surface of the substrate. The substrate includes a bottom layer and a metallized layer. At least a first element of the pattern is formed by ablating the element into a resist coating or ablating the element into the metallized layer with the coherent light source. The coherent light source preferably includes an excimer laser. The substrate is then displaced relative to the coherent light source until all the elements of the predetermined pattern are formed over the entire surface of the substrate. When the pattern is ablated into the resist material, an etching technique is used to remove portions of the metallized layer from the substrate.

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