Ablation pattering of multilayered structures

Details Ablation pattering of multilayered structures Ablation pattering of multilayered structures

1997-03-31

1998-06-16

Powell, William

Etching a substrate: processes

Etching to produce porous or perforated article

216 62, 216 65, 216 66, 438690, B44C 122, H01L 2100

Patent

active

057664978

ABSTRACT:
A process for ablation etching through one or more layers of dielectric materials while not etching an underlying conductive material layer comprises selecting parameters whereby the ablation process automatically stops when the conductive material layer is reached, or monitoring the process for end point detection of the desired degree of ablation. Parameters selected are the absorptivity of the dielectric layer versus that of the conductive material layer. End point detection comprises monitoring radiant energy reflected from the workpiece or the content of the materials being ablated from the workpiece.

REFERENCES:
patent: 5302547 (1994-04-01), Wojnarwski et al.
patent: 5505320 (1996-04-01), Burns

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