Patent
1977-08-09
James, Andrew J.
357 74, 357 79, 357 81, H01L 2328, H01L 2302, H01L 2312, H01L 2342
Patent
active
040415236
ABSTRACT:
A controllable semiconductor component element has a housing of two massive metal bodies, each of which has a flange which is axially and radially embraced by an insulating ring. A semiconductor element is mounted between the metal bodies and has a cathode side and an anode side carrying a cathode and an anode, respectively which are conductively connected, with respect to heat and current, to the respective metal bodies. The anode is in the form of a ring which circumscribes a control electrode. A lead is connected to the control electrode and extends through an axial opening in the cathode side metal body to the exterior for connection, by way of spring tension, solder or the like to a control lead. The opening is completely filled with an insulating material to center and rigidly fix the lead therein. Each of the metal bodies is conically shaped, tapering away from the semiconductor element, and includes a rounded end to be received in a pressure spring.
REFERENCES:
patent: 3513361 (1970-05-01), Meyerhoff
patent: 3525910 (1970-08-01), Philips
patent: 3636419 (1972-01-01), Raithel et al.
patent: 3962719 (1976-06-01), Pfaff
James Andrew J.
Siemens Aktiengesellschaft
LandOfFree
A controllable semiconductor component having massive heat dissi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with A controllable semiconductor component having massive heat dissi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and A controllable semiconductor component having massive heat dissi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1232559