8-beam bridge-type silicon acceleration sensor and the fabricati

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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1566571, 1566621, 216 2, 216 99, 7351434, H01L 2100

Patent

active

055000789

ABSTRACT:
A method for fabricating an 8-beam bridge-type silicon acceleration sensor omprises the steps of: growing a silicon oxide layer on the top surface of the silicon substrate; forming an n.sup.+ diffusion region in the substrate by successively performing the process of opening a diffusion window in the silicon oxide layer, implanting n.sup.+ impurities in the silicon substrate through the diffusion window, and evenly diffusing the n.sup.+ impurities into the substrate; removing the silicon oxide layer, and then growing an epitaxial layer thereon; forming a plurality of piezo-resistors in the epitaxial layer by successively performing the process of growing an oxide layer on the epitaxial layer, implanting impurities, and then evenly diffusing the impurities; removing the silicon oxide layer; forming a porous silicon layer from the n.sup.+ diffusion region by performing an anodic reaction in HF solution; loading a mass on the epitaxial layer; and, forming an air-gap in the substrate by etching the porous silicon layer.

REFERENCES:
patent: 4744863 (1988-05-01), Guckel et al.
patent: 5332469 (1994-07-01), Motamedi

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