3D lithography with laser beam writer for making hybrid...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C216S067000

Reexamination Certificate

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11282884

ABSTRACT:
A method of etching a feature in a surface of a substrate. The substrate is provided. A photoresist layer is formed on the surface of the substrate. A thickness profile of the formed photoresist layer is determined. A grayscale scanning pattern is determined based on the feature and the thickness profile of the photoresist layer. The determined grayscale scanning pattern is laser written on the photoresist layer to expose a portion of the photoresist layer. The exposed portion of the photoresist layer is removed to form a grayscale pattern in the photoresist layer. The photoresist layer and the surface of the substrate are etched to form the feature in the surface of the substrate.

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Wolf et al. “Silicon Processing for the VLSI Era”, vol. 1, 1986, lattice Press, p. 431.
“Diffractive Optics: Design, Fabrication, and Test”, by Donald C. O'Shea et al., Publication date: Dec. 2003, Chapter 5, Design of Diffraction Gratings, (pp. 83-85); Chapter 6, Making A Diffractive Optical Element, (pp. 115-118); Chapter 7, “Photolithographic Fabrication of Diffractive Optical Elements”, (pp. 133-135).

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