3-dimensional flash memory device, method of fabrication and...

Details 3-dimensional flash memory device, method of fabrication and... 3-dimensional flash memory device, method of fabrication and...

2011-06-14

2011-06-14

Hoang, Quoc D (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C438S109000, C257SE21614, C257SE25006

Reexamination Certificate

active

07960844

ABSTRACT:
Disclosed are a flash memory device and method of operation. The flash memory device includes a bottom memory cell array and a top memory cell array disposed over the bottom memory cell array. The bottom memory cell array includes a bottom semiconductor layer, a bottom well, and a plurality of bottom memory cell units. The top memory cell array includes a top semiconductor layer, a top well, and a plurality of top memory cell units. A well bias line is disposed over the top memory cell array and includes a bottom well bias line and a top well bias line, The bottom well bias line is electrically connected to the bottom well, and the top well bias line is electrically connected to the top well.

REFERENCES:
patent: 6541324 (2003-04-01), Wang
patent: 7271451 (2007-09-01), Liaw
patent: 7355885 (2008-04-01), Fukuzumi
patent: 2007/0200182 (2007-08-01), Liaw
patent: 2006019735 (2006-01-01), None
patent: 100230426 (1999-08-01), None
patent: 100687051 (2007-02-01), None
patent: 1020080035799 (2008-04-01), None
patent: 100829611 (2008-05-01), None

Affiliated with

Also associated with

Rating

3-dimensional flash memory device, method of fabrication and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with 3-dimensional flash memory device, method of fabrication and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and 3-dimensional flash memory device, method of fabrication and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2627650