3-D CMOS-on-SOI ESD structure and method

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438199, 438200, H01L 2100, H01L 2184

Patent

active

060748990

ABSTRACT:
Three-dimensional ESD structures are constructed in SOI technology that utilize both bulk devices and thin film SOI devices.

REFERENCES:
patent: 4596604 (1986-06-01), Akiyama et al.
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 4834809 (1989-05-01), Kakihara
patent: 4902637 (1990-02-01), Kondou et al.
patent: 4907053 (1990-03-01), Ohmi
patent: 5028976 (1991-07-01), Ozaki et al.
patent: 5181091 (1993-01-01), Harrington, III et al.
patent: 5294556 (1994-03-01), Kawamura et al.
patent: 5294821 (1994-03-01), Iwamatsu
patent: 5359219 (1994-10-01), Hwang
patent: 5382818 (1995-01-01), Pein
patent: 5382832 (1995-01-01), Buti et al.
patent: 5399507 (1995-03-01), Sun
patent: 5414288 (1995-05-01), Fitch et al.
patent: 5422302 (1995-06-01), Yonehara et al.
patent: 5426062 (1995-06-01), Hwang
patent: 5426072 (1995-06-01), Finnila
patent: 5473181 (1995-12-01), Schwalke et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

3-D CMOS-on-SOI ESD structure and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with 3-D CMOS-on-SOI ESD structure and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and 3-D CMOS-on-SOI ESD structure and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2067870

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.