Organic compounds -- part of the class 532-570 series – Organic compounds – Heterocyclic carbon compounds containing a hetero ring...
Reexamination Certificate
2004-04-13
2008-12-23
Eashoo, Mark (Department: 1796)
Organic compounds -- part of the class 532-570 series
Organic compounds
Heterocyclic carbon compounds containing a hetero ring...
C548S100000, C528S408000
Reexamination Certificate
active
07468441
ABSTRACT:
Compounds of the general formulae (I) and (II): where R1, R2and R3each independently of one another are H; C1-17alkyl; C3-12cycloalkyl, optionally substituted by C1-4alkyl groups; C4-20cycloalkyl-alkyl, optionally substituted by C1-4alkyl groups; C6-10, aryl, optionally substituted by 1-3 C1-4alkyl groups, —CN, Hal, OH, or C1-10alkoxy; C7-15phenylalkyl, optionally substituted by 1-3 C1-4alkyl groups; C3-12alkenyl; C3-12alkynyl; or aromatic or aliphatic C3-12acyl; R4, R5, R6, R7, R8, and R9each independently of one another are H; C1-17alkyl, C3-12cycloalkyl, optionally substituted by C1-4alkyl groups; C4-20cycloalkyl-alkyl, optionally substituted by C1-4alkyl groups; C6-10aryl, optionally substituted by 1-3 C1-4alkyl groups; C7-15phenylalkyl, optionally substituted by 1-3 C1-4alkyl groups; C3-17alkenyl; C3-12alkynyl; C1-12alkoxy; or OH; for formula (1) R is C1-12alkyl; C3-12cycloalkyl, optionally substituted by C1-4alkyl groups; C4-20cycloalkyl-alkyl; optionally substituted by C1-4alkyl groups; C6-10aryl, optionally substituted by 1-3 C1-4alkyl groups; C7-15phenylalkyl, optionally substituted by 1-3 C1-4alkyl groups; C3-12alkenyl; or C3-12alkynyl; and for formula (II) n=2-12; as accelerators in curable epoxy resin compositions which are used as a compression moulding compound, sinter powder, encapsulating system, or casting resin, or for producing prepregs and laminates having very good interlaminar shear strength values using the resin infusion method, wet layup method and injection methods, for producing components, especially components of large surface area.
REFERENCES:
patent: 3356645 (1967-12-01), Warren
patent: 3914236 (1975-10-01), Lerch et al.
patent: 4101514 (1978-07-01), Thom
patent: 4463011 (1984-07-01), Ogata et al.
patent: 4487914 (1984-12-01), Barton
patent: 4549008 (1985-10-01), Renner
patent: 4602022 (1986-07-01), Cozzi et al.
patent: 4649181 (1987-03-01), Darms
patent: 4666954 (1987-05-01), Forgo et al.
patent: 4677170 (1987-06-01), Monnier
patent: 5001212 (1991-03-01), Hammer
patent: 5134111 (1992-07-01), Okita et al.
patent: 5298649 (1994-03-01), Okita et al.
patent: 5591811 (1997-01-01), Blyakhman
patent: 6245835 (2001-06-01), Klein et al.
patent: 6555690 (2003-04-01), Johnson et al.
patent: 6713632 (2004-03-01), Kawakami
patent: 7323485 (2008-01-01), Chow et al.
patent: 2002/0111422 (2002-08-01), Back et al.
patent: 2004/0009976 (2004-01-01), Takeuchi et al.
patent: 2006/0247259 (2006-11-01), Funahashi et al.
patent: 648844 (1985-04-01), None
patent: 0761709 (1997-03-01), None
Eashoo Mark
Hunstman Advanced Materials Americas Inc.
McCulley Megan
LandOfFree
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