4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Chip mounted on chip
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Smart Pac GmbH - Technology Services

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Son Min-young

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Sox Stephen E.

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Sprouse Steven T.

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Tabrizi Behnam

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Takatsuki Ryo

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Tetsuka Takashi

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Thermoplastic Composite Designs, Inc.

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Thewes Roland

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Thome John R.

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Trial & Technology Law Group

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