Modified epoxy resin, epoxy resin composition and cured product
Modified imidazole latent epoxy resin catalysts and systems comp
Modified melamine-formaldehyde resins
Modified novolak terpene products
Modified phenol resole ether resins and their preparation
Modified phenolic aldehyde resin to produce an improved adhesive
Modified phenolic resin and uses related thereto
Modified poly(aryl ether ketones) derived from biphenol
Modified poly(aryl ether ketones) derived from biphenol
Modified polyarylate resin and composition comprising the same
Modified polyimide resin and thermosetting resin composition...
Modified polyoxyalkylenepolyamine curing agents for epoxy resins
Modified polyphenylene ether, process for preparing the same and
Modified polytrimethylene terephthalate
Modified tannin mannich polymers
Moisture curable epoxy compositions containing dicarbonyl chelat
Moisture-curing acrylate/epoxy hybrid adhesives
Moldable compositions
Moldable high molecular weight aromatic polyamide from poly aryl
Moldable/extrudable thermotropic aromatic copolyesteramides