4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Smart card package
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Thin IC card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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Transportable object and process of production

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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Two-stage transfer molding device to encapsulate MMC module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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Two-stage transfer molding device to encapsulate MMC module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Two-stage transfer molding method to encapsulate MMC module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
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