4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material
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Bump chip scale semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Bumped integrated circuits for optical applications

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Bumpless assembly package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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