4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Outside periphery of package having specified shape or...

Hitachi Hokkai Semiconductor Ltd.

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Ball grid array type semiconductor package having a flexible...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Ball grid array type semiconductor package having a flexible...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Electronic device and a method of manufacturing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Fabrication method of semiconductor integrated circuit device

Semiconductor device manufacturing: process – Gettering of substrate – By vapor phase surface reaction
Reexamination Certificate

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Fabrication method of semiconductor integrated circuit device

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate

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