4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Jun Min Hu

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Plastic encapsulated IC package and method of designing same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Plastic encapsulated IC package and method of designing same

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1715911

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