Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1998-10-14
2000-12-26
Abraham, Fetsum
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257756, 257757, 257759, H01L 23552
Patent
active
061664405
ABSTRACT:
A vertical or parallel interconnection structure in a semiconductor device wherein a shielding means is provided to prevent signal coupling between signal lines having small swing signals and noise sensitive signals. The shielding means is disposed between the signal lines and parallel with them and driven by power source of stable level, for example a ground voltage, a power supply voltage, or a DC voltage of arbitrary level.
REFERENCES:
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Basel, "Accurate and Efficient Extraction of Interconnect Circuits for Full-Chip Timing Analysis," pp. 118-123, 1995.
Huang et al., "Accurate Modeling of Capacitive, Resistive and Inductive Effects of Interconnect," pp. 115-117.
Ruehli et al., "Efficient Capacitance Calculations for Three-Dimensional Multiconductor Systems," IEEE Transactions on Microwave Theory and Techniques, vol. MTT-21, No. 2, pp. 76-82, Feb. 1973.
Huang, "Two-Dimensional Capacitance Calculation in Stratified and/or Arbitrary Dielectric Media," IEEE Transactions on Microwave Theory and Techniques, vol. 42, No. 3, pp. 501-504, Mar. 1994.
Abraham Fetsum
Samsung Electronics Co,. Ltd.
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