Lead frame, method for manufacturing the frame, resin-molded sem

Details Lead frame, method for manufacturing the frame, resin-molded sem Lead frame, method for manufacturing the frame, resin-molded sem

1999-02-04

2000-12-26

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257787, 257676, H01L 23495

Patent

active

061664308

ABSTRACT:
The lead frame of the present invention includes: an outer frame having an opening; a plurality of leads consisting of outer and signal-connecting leads and extending inside the opening from the outer frame toward a region in which the semiconductor chip is mounted; a die pad disposed inside the opening; and a plastic film adhered to respective lower surfaces of the die pad, the outer frame and the signal-connecting leads. This lead frame is not provided with support leads and the die pad is indirectly supported by the outer frame with the plastic film. Since no support leads are provided, the size of an installable semiconductor chip can be enlarged and the overall size of a semiconductor device can be reduced.

REFERENCES:
patent: 5294827 (1994-03-01), McShane
patent: 5521429 (1996-05-01), Aono et al.
patent: 5841187 (1998-11-01), Sigimoto et al.
patent: 5844307 (1998-12-01), Suzuki et al.
patent: 5900676 (1999-05-01), Kweon et al.
patent: 5973388 (1999-10-01), Chew et al.
patent: 5977613 (1999-11-01), Takata et al.

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