Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-02-13
1988-03-01
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29846, 156634, 156656, 1566611, 156902, 310208, 430312, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
047283904
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a filmy coil and a manufacturing method for such coil, and the object of the present invention is to provide a filmy coil of great electric characteristics having an extremely high-density pattern for use in a flat-motor and the like, and to provide a manufacturing method for such coil.
BACKGROUND OF THE INVENTION
Conventionally, this kind of filmy coil has been manufactured using a material which carries a conductive layer such as a metallic foil, a deposit, or a metallic deposit. On the surface of said conductive layer a patterned resist layer is provided, and then the surface, namely, one side of the conductive layer is etched chemically to form a linear conductive layer. With this conventional manufacturing method, however, there is the disadvantage that it takes a lot of time to etch the conductive layer from one side until it is penetrated, which raises the production cost. Moreover, particularly from a technical viewpoint, as the quantity of side etching is increased excessively and the width of a line is thinned (see FIG. 1), the interval between the lines is enlarged in order to attain a conductive layer of a proper-width-line (see FIG. 2). Therefore, another disadvantage is that a low-patterned coil is the best that can be produced.
SUMMARY OF THE INVENTION
The present inventors have found, as a result of various studies and improvements, to improve the disadvantages of the prior art as described above, that annexation of sandwich simultaneous etching and single-sided etching, both used in photoetching, eliminate the above-described disadvantages and attains the object. On the basis of this information, the present invention was completed at last.
Namely, the present invention relates to a filmy coil comprising a metal conductive layer having a thin line with a series of spiral patterns provided on one side or both sides of an optionally isolated substrate film or sheet, characterized in that the interval between each adjacent metal conductive layer is smaller than the thickness of said metal conductive layer.
Furthermore, the present invention relates to a manufacturing method for a filmy coil, characterized in that photoresist layers are formed on both sides of a metal foil or sheet, such that the sides are mirror images of each other. Both sides are etched to the degree of 30 to 40% of the thickness of the metal conductive foil or sheet by means of chemical etching. Then one side of the foil or sheet is covered with an isolated resin coat or is laminated with an isolated substrate film or sheet layer. Thereafter, the other side of said foil or sheet is etched again by chemical etching until the etching grooves on both sides of said foil or sheet have penetrated each other, and a filmy coil forming a metal conductive layer of a thin line is obtained. The rear sides of two filmy coils as above-described are laminated to each other if necessary.
DESCRIPTION OF THE EMBODIMENT
The present invention will be described in detail with respect to the drawings, in which:
FIGS. 1 and 2 are expanded cross-sectional views explaining the single-side etching used in the prior art;
FIGS. 3(a) to (f) are cross-sectional views explaining each process step of the manufacturing method according to the present invention;
FIG. 4 is a view explaining one preferred embodiment according to the present invention in which filmy coils are laminated (a cross-sectional view);
FIGS. 5(a) to (f) are views explaining preferred embodiments according to the present invention as to the configuration of the film (a plan view); and
FIGS. 6(a) to (f) are views explaining the manufacturing process to use in equalizing the width of lines on both sides of a coil portion (a cross-sectional view).
First of all, the filmy coil according to the present invention will be described with reference to its manufacturing process. As shown in FIG. 3(a), a metal foil or sheet made of a good conductive material such as copper, silver, aluminum, nickel, gold, iron or chrome is used as
REFERENCES:
patent: 3264152 (1966-08-01), Haydon
Iwata Torayoshi
Mori Yasuji
Yamamoto Kunitoshi
Nissha Printing Co. Ltd.
Powell William A.
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