Thin type semiconductor package

Details Thin type semiconductor package Thin type semiconductor package

1997-07-09

2000-04-25

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257679, 257692, 257778, H01L 2941

Patent

active

06054774&

ABSTRACT:
A semiconductor package having a board, at least one semiconductor chip, and flat type external connecting terminals, the board having a wiring circuit including connecting portions on a first main surface, the semiconductor being mounted on the first main surface, the flat type external connecting terminals being electrically connected to the semiconductor chip and formed on a second main surface of the board, wherein the flat type external connecting terminals are disposed in such a manner that any straight line which is arbitrarily drawn across the surface of a region to form the flat type external connecting terminals of the board runs on at least one of the flat type external connecting terminals.

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Japanese Industrial Standard, "Integrated Circuit Cards with Contacts-Physical Characteristics and Location of Contact", JIS X 6303, 1988.
E. Harari, Nikkei Electronics, Feb. 17, 1992, pp. 155-168.

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