Method of making components with solder balls

Details Method of making components with solder balls Method of making components with solder balls

1998-07-14

2000-12-26

Nelms, David

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438614, 438615, 438616, 257737, 257738, H01L 2144

Patent

active

061658855

ABSTRACT:
An electronic component with solder ball connections is provided. A stencil is produced with holes passing through it in an arrangement corresponding to an arrangement of conductive pads on a substrate or integrated circuit. The stencil is made of a solder reflow compatible material. A layer of adhesive is applied to the stencil which is then positioned with the layer of adhesive adjacent the substrate or integrated circuit with the holes aligned with the conductive pads. Solder paste is deposited in the holes and is heated along with the conductive pads to form solder balls on the conductive pads.

REFERENCES:
patent: 4256532 (1981-03-01), Magdo et al.
patent: 5880017 (1999-03-01), Schwiebert et al.

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