Semiconductor device package

Details Semiconductor device package Semiconductor device package

1992-03-25

1995-12-19

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257684, 257701, 257704, 257712, H01L 2302, H01L 23053, H01L 2312

Patent

active

054770815

ABSTRACT:
A semiconductor device package includes a semiconductor package element for containing a semiconductor chip, a lid bonded to the semiconductor package using an adhesive agent, and a cooler bonded to a surface of the lid. The bonded surface between the semiconductor package and the lid is positioned inside the periphery of the lid by a predetermined distance. Thus, the adhesive agent does not adhere to a side nor surface of the lid and a cooler can be easily bonded to the lid surface. As a result, a highly reliable semiconductor device is provided and easily aligned at the time of forming a module by using a plurality of packages.

REFERENCES:
patent: 3740920 (1973-06-01), Lane
patent: 4788626 (1988-11-01), Neidig et al.
patent: 4926242 (1990-05-01), Itoh et al.
A. H. Kumar and J. Ordonez, IBM Technical Disclosure Bulletin, vol. 24, No. 12, "Compact Thermal Conduction Module", May 1982, pp. 6432-6433.
Roupen L. Keusseyan, IEEE Transaction on Components and Manufacturing Technology, vol. 13, No. 1, "Brazing to Low-Temperature-Fired Thick Films", Mar. 1990, pp. 219-221.
Denda et al, "4.times.4096-Element SW IR Multispectral Focal Plane Array", SPIE, vol. 819, Infrared Technology XIII, 1987, pp. 279-286.

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