Integrated circuit device and manufacturing method using photore

Details Integrated circuit device and manufacturing method using photore Integrated circuit device and manufacturing method using photore

1994-05-03

1995-06-06

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437214, 437219, 437220, H01L 2160

Patent

active

054223130

ABSTRACT:
A method of making an integrated circuit (IC) device comprises the steps of providing (300) at least one lead frame (10) comprising a plurality of leads (14), laminating (302) the lead frame (10) with a photoresist, exposing (304) a portion of the photoresist to impose a pattern on the photoresist (10), and developing (306) the photoresist on lead frame (10), such that the photoresist produces a pair of strips and forms non-electrically conductive bonds (30, 32) between leads (14). Further, an IC device comprises a plurality of leads (14) extending from a lead frame (10). The leads (14) comprise an inner lead portion (26), a middle lead portion (27) and an outer lead portion (28). A photoresist is overlaid onto the leads (14). The photoresist comprises an inner strip (30) disposed across the plurality of leads (14) between the inner lead portion (26) and the middle lead portion (27) and an outer strip (32 ) disposed across the plurality of leads (14) between the outer lead portion (28) and the middle lead portion (27). The photoresist inhibits cavity molding (42) plastic from seeping onto inner lead portion (26) or outer lead portion (28) and creates a non-electrically conductive bond between the leads (14).

REFERENCES:
patent: 4143456 (1979-03-01), Inoue
patent: 4857483 (1989-08-01), Steffen et al.
patent: 4868635 (1989-09-01), Frechette et al.
patent: 5196268 (1993-03-01), Fritz
patent: 5258331 (1993-11-01), Masumoto et al.
patent: 5270262 (1993-12-01), Switky et al.
patent: 5290735 (1994-03-01), Haley
Vacrel.RTM. 8100 Series Data Sheet--Photopolymer Film Solder Mask System by E.I. Du Pont De Nemours & Co. (Inc.) (Apr. 1989).
Material Safety Data Sheet--"Vacrel" 8100 Series Photopolymer Solder Masks (Vapors) by E.I. Du Pont De Nemours & Co. (Inc.) (Jun. 25, 1992).
Technical Data Sheet--Dynamask.TM. KM Dry Film Solder Mask by Dynachem Division of Morton Thiokok, Inc. (Dec. 1989).
Material Safety Data Sheet--Dynamask.TM. KM Dry Film Solder Mask by Dynachem Division of Morton Thiokol, Inc. (May 30, 1989).
PAC New Product Announcement--Plastic Cavity Package by Texas Instruments, Inc. (undated).

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