Method of preventing deformation of lead frames

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29856, 29DIG12, 257676, 361813, H01L 2148, C25D 502

Patent

active

054759188

ABSTRACT:
Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step.

REFERENCES:
patent: 4033844 (1977-07-01), Pantiga et al.
patent: 4089733 (1978-05-01), Zimmerman
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4894752 (1990-01-01), Murata et al.
patent: 5227662 (1993-07-01), Ohno et al.

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