Lead frame transfer device and wire bonding apparatus comprising

Details Lead frame transfer device and wire bonding apparatus comprising Lead frame transfer device and wire bonding apparatus comprising

1998-07-28

2000-04-25

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

156569, B32B 3100

Patent

active

060532343

ABSTRACT:
A lead frame transfer device includes a platform, and front and rear fingers for moving the lead frame from a transfer position to a feeding position, via the platform, with minimal impact and while producing minimal mechanical abrasion. Each of the fingers includes a plate-like support for the lead frame, a vertical cylinder for moving the support in a vertical direction, and a horizontal cylinder for moving the support in a horizontal direction. The device also has a sensor for detecting the presence of a lead frame on the platform, and which detection is used to control the movement of the plate-like supports. A wire bonding apparatus employs two of such transfer devices on either side of a wire bonding head. Transfer rails extend past the transfer devices. One of the transfer devices serves as a loading mechanism which transfers a lead frame from the rails to the wire bonding head, while the other transfer device serves as an unloading mechanism which transfers the lead frame from the wire bonding head back onto the transfer rails. A plurality of the wire bonding apparatuses can be linked together to provide an in-line wire bonding apparatus. The wire bonding apparatuses receive the lead frames from a die bonding apparatus via a buffer which includes at least one magazine.

REFERENCES:
patent: 3698621 (1972-10-01), Burke et al.
patent: 3928749 (1975-12-01), Herrmann
patent: 3937386 (1976-02-01), Hartleroad et al.
patent: 4457662 (1984-07-01), Ireland
patent: 4524601 (1985-06-01), Bernardi
patent: 4550871 (1985-11-01), Chan et al.
patent: 4627151 (1986-12-01), Mulholland et al.
patent: 4765531 (1988-08-01), Ricketson et al.
patent: 5082165 (1992-01-01), Ishizuka
patent: 5148908 (1992-09-01), Ishizuka et al.
patent: 5201977 (1993-04-01), Aoshima
patent: 5372972 (1994-12-01), Hayashi et al.
patent: 5653575 (1997-08-01), Park et al.
patent: 5897290 (1999-04-01), Lu et al.
patent: 5899341 (1999-05-01), Irita

Affiliated with

Also associated with

Rating

Lead frame transfer device and wire bonding apparatus comprising does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame transfer device and wire bonding apparatus comprising, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame transfer device and wire bonding apparatus comprising will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-985732