Resin sealing/molding apparatus for electronic parts

Details Resin sealing/molding apparatus for electronic parts Resin sealing/molding apparatus for electronic parts

1996-10-25

1998-05-12

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

4251291, 425544, 425546, 425812, 425DIG47, 425DIG60, 425DIG228, 26427217, 249141, B29C 4502, B29C 4514, B29C 4534

Patent

active

057501548

ABSTRACT:
A fixture for fixing an annular upper air isolation member which is provided around an outer side of an upper mold section to an upper mounting plate is released, thereby rotating the air isolation member by a rotational member and fixing the same by a rotational position regulating member. An upper chase unit is exchanged through an upper opening which is defined by the upper mounting plate and the rotated air isolation member. A lower chase unit is also exchanged in a similar manner. Due to this structure, a sealing mechanism for a resin sealing/molding apparatus for electronic parts which can readily and quickly exchange a mold in response to small lot production of various types of products is provided.

REFERENCES:
patent: 5196206 (1993-03-01), Troia et al.
patent: 5236636 (1993-08-01), Tisack
patent: 5518385 (1996-05-01), Graff
patent: 5540576 (1996-07-01), Kawakita et al.
patent: 5603879 (1997-02-01), Osada et al.

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