Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1993-06-28
1995-08-08
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257713, 257717, 257718, 257719, 361704, 361705, 361708, 361746, H01L 2302, H02B 104, H02B 120
Patent
active
054401720
ABSTRACT:
An apparatus comprises a thermal energy generating device and a thermal energy dissipating device having a reduced thermal resistance of the interface between the two. The reduction is achieved by interposing a xylylene polymer layer between the two contact surfaces and applying a surface pressure sufficient to deform the xylylene polymer layer into the surface irregularities of the two surfaces. A reduction in the thermal resistance comparable to that which may be achieved by the use of a silicone grease or an indium foil may be realized if the layer is kept below eight times the air gap mean thickness caused by the surface irregularities. Layer thicknesses beyond this will serve to insulate or increase the thermal resistance between the two surfaces.
REFERENCES:
patent: 4893174 (1990-01-01), Yamada et al.
Experimental/Numerical Heat transfer in Combustion and Phase Change, HTD-vol. 170, 1991, Antonetti et al, "An Approximal Thermal Contact Conduction Correlation", 35-42.
P. W. O'Callaghan et al, 1981, "Prediction of Optimal Interfacial Filler Thickness for Minimum Thermal Contact Resistance", 1-7.
Snaith et al, 1984, "Interstitial Materials for Controlling Thermal Conductances Across Pressed Metallic Contacts", 175-191.
Crane Sara W.
Jr. Carl Whitehead
Makeever Jeffery J.
Sundstrand Corporation
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