Semiconductor manufacturing apparatus with a spare vacuum chambe

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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118715, 118719, 20429815, 20429825, 20429826, C23F 102

Patent

active

054395470

ABSTRACT:
In a semiconductor manufacturing apparatus, provided are a vacuum processing chamber which implements a required processing to an object of processing under an atmosphere of reduced pressure, a single spare vacuum processing chamber provided to one side and adjacent to the vacuum processing chamber and provided with a support mechanism to support the object of processing and a conveyor arm to convey the object of processing internally. Thus the object of processing is conveyed to the vacuum processing chamber and conveyed from the vacuum processing chamber via the spare vacuum processing chamber.

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patent: 4785962 (1988-11-01), Toshima
patent: 4816638 (1989-03-01), Ukai et al.
patent: 4891087 (1990-01-01), Davis et al.
patent: 5019233 (1991-05-01), Blake
patent: 5110394 (1992-05-01), Ogawa
patent: 5186594 (1993-02-01), Toshima et al.
patent: 5246528 (1993-09-01), Hasegawa et al.

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