Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-05-02
1986-08-05
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29572, 29580, 29583, 156633, 156647, 156651, 156657, 1566591, 156662, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
046041613
ABSTRACT:
A sensor array for butting against other like arrays to form a full width array. The active surface of the array chip is first etched to form a V-shaped groove defining an array end; then a parallel groove is cut in the opposite inactive surface with a centerline parallel to but offset from the centerline of the V-shaped groove by an amount sufficient to allow extension of the wafer (111) crystalline plane from the V-shaped groove to the cut groove; then the water is supported in cantilever fashion along an edge substantially coplanar with the V-shaped groove and a downward force is applied to the wafer free end to cause the wafer to fracture along the (111) crystalline plane thereby cleaving the chip from the wafer and providing a uniformly smooth and straight array end for butting against the end of a like array.
REFERENCES:
patent: 3247576 (1966-04-01), Dill, Jr. et al.
patent: 3936329 (1976-02-01), Kendall et al.
patent: 4019248 (1977-04-01), Black
patent: 4269653 (1981-05-01), Wada et al.
patent: 4325182 (1982-04-01), Tefft et al.
Herrman, "Silicon Chip Separation to Permit Chip Butting", RCA Technical Notes, TN No. 1110, May 1975.
Tsang et al., "Preferentially Etched Diffraction Gratings in Silicon", Journal of Applied Physics, May 1975, No. 5, pp. 2163-2166.
Bassous, "Fabrication of Novel Three-Dimensional Microstructures by the Anisotropic Etching of (100) and (110) Silicon", IEEE Transactions, vol. ED-25, No. 10, Oct. 1978, pp. 1178-1185.
McMullen Frederick E.
Powell William A.
Xerox Corporation
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