Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1999-08-27
2000-12-05
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257668, 257690, 257688, H01L 2302, H01L 23495, H01L 2348
Patent
active
061570753
ABSTRACT:
A semiconductor chip assembly with a compliant layer overlying the chip and a flexible dielectric layer overlying the compliant layer. Connecting terminals are provided on the dielectric layer for connection to a larger substrate. The connecting terminals are moveable in vertical directions toward the chip. Bonding terminals, electrically connected to the connecting terminals, are also provided on the top layer. A reinforcing element resists vertical movement of the bonding terminals, and thereby facilitates connection of leads between the bonding terminals and the chip.
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patent: 5525545 (1996-06-01), Grube et al.
patent: 5627405 (1997-05-01), Chillara
patent: 5677576 (1997-10-01), Akagawa
patent: 5777379 (1998-07-01), Karavakis et al.
Fjelstad Joseph
Karavakis Konstantine
Clark Jhihan B
Saadat Mahshid
Tessera Inc.
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