Semiconductor assemblies with reinforced peripheral regions

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257668, 257690, 257688, H01L 2302, H01L 23495, H01L 2348

Patent

active

061570753

ABSTRACT:
A semiconductor chip assembly with a compliant layer overlying the chip and a flexible dielectric layer overlying the compliant layer. Connecting terminals are provided on the dielectric layer for connection to a larger substrate. The connecting terminals are moveable in vertical directions toward the chip. Bonding terminals, electrically connected to the connecting terminals, are also provided on the top layer. A reinforcing element resists vertical movement of the bonding terminals, and thereby facilitates connection of leads between the bonding terminals and the chip.

REFERENCES:
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5183711 (1993-02-01), Wada et al.
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5525545 (1996-06-01), Grube et al.
patent: 5627405 (1997-05-01), Chillara
patent: 5677576 (1997-10-01), Akagawa
patent: 5777379 (1998-07-01), Karavakis et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor assemblies with reinforced peripheral regions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor assemblies with reinforced peripheral regions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor assemblies with reinforced peripheral regions will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-963987

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.