Method of correcting solder bumps

Details Method of correcting solder bumps Method of correcting solder bumps

1998-07-31

2000-12-05

Elms, Richard

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, H01L 2144

Patent

active

061566357

ABSTRACT:
An IC substrate provided with a plurality of solder bumps is prepared. Flux is applied to solder bumps. Solder bumps are heated for melting. Solder bumps are pressed against a heating portion having a flat surface. Solder bumps are cooled. An improved method of correcting solder bumps, which permits good soldering is provided.

REFERENCES:
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5684330 (1997-11-01), Lee
patent: 5686353 (1997-11-01), Yagi et al.
patent: 5765744 (1998-06-01), Tatumi et al.
patent: 5872051 (1995-02-01), Fallon et al.

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