Method of forming insulating material between components of an i

Details Method of forming insulating material between components of an i Method of forming insulating material between components of an i

1999-03-16

2000-12-05

Talbot, Brian K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427344, 427387, 4274192, 438409, 438623, 438787, 438960, B05D 512, H01L 2176

Patent

active

061563749

ABSTRACT:
The invention includes a method of forming an insulating material between components of an integrated circuit. A pair of spaced electrical components are provided over a substrate. Polysilicon is chemical vapor deposited over, between, and against the pair of electrical components. Cavities are formed within the polysilicon to enhance porosity of the polysilicon. After the cavities are formed, at least some of the polysilicon is transformed into porous silicon dioxide.

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