Attachment method for heat sinks and devices involving removal o

Details Attachment method for heat sinks and devices involving removal o Attachment method for heat sinks and devices involving removal o

1998-09-03

2000-09-12

Bowers, Charles

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Combined with the removal of material by nonchemical means

438122, 438127, H01L 2148

Patent

active

061177970

ABSTRACT:
A process for forming a thermally enhanced Chip On Board semiconductor device with a heat sink is described. In one aspect, a thermally conducting interface material of filled gel elastomer material or a silicone elastomeric material or other elastomeric material is applied to the die surface to which the heat sink is to be bonded. A protective elastomeric layer is then applied to the interface material (or bare die). During subsequent glob top application and curing steps, it is conventionally difficult to remove unwanted glob top material, that which may have been unintentionally misapplied to the die surface. In the practice of this invention, the misplaced encapsulant (glob top) material adheres to the upper surface of the protective layer. The protective layer of material is then removed by peeling to also remove the misplaced glob top material prior to adhesion bonding of the heat sink to the die.

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