Method for making a multi-tier laminate substrate with internal

Details Method for making a multi-tier laminate substrate with internal Method for making a multi-tier laminate substrate with internal

1996-10-17

1998-03-17

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156263, 1562733, 1562735, 1563066, 361711, 361712, B32B 3112, B32B 3118

Patent

active

057282480

ABSTRACT:
A multi-tier laminate substrate with an internal heat spreader and method for making a multi-tier laminate substrate with an internal heat spreader for electronic device packaging are provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate.

REFERENCES:
patent: 4677526 (1987-06-01), Muehling
patent: 4972253 (1990-11-01), Palino et al.
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5089878 (1992-02-01), Lee
patent: 5102829 (1992-04-01), Cohn
patent: 5191511 (1993-03-01), Sawaya
patent: 5622588 (1997-04-01), Weber
Ron Iscoff; "Hestia Technologies Begins High Performance PQFP Deliveries"; Semiconductor International; Jun., 1990.
"HDP User Group/SEMI Packaging Array Workshop"; Cambridge, Mass., Jun. 14, 1993.

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