Method of forming chip bumps of bump chip scale semiconductor pa

Details Method of forming chip bumps of bump chip scale semiconductor pa Method of forming chip bumps of bump chip scale semiconductor pa

1997-03-07

1999-06-01

Graybill, David

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438614, 22818022, H01L 21283, H01L 2156, H01L 2158, H01L 21603

Patent

active

059083174

ABSTRACT:
A method of forming chip bumps of a bump chip scale semiconductor package, such a package and a chip bump are disclosed. In the bump chip scale semiconductor package produced by the above method, the chip bumps are directly formed on the chip pads of a semiconductor chip. The above chip bumps are used as the signal input and output terminals of the package and are used as surface mounting joints when the chip is mounted to a mother board.

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