Coplanar waveguide semiconductor package

Details Coplanar waveguide semiconductor package Coplanar waveguide semiconductor package

1990-03-23

1991-05-07

Hille, Rolf

357 80, H01L 2312, H01L 2314, H01L 2348

Patent

active

050141155

ABSTRACT:
A package for a semiconductor device includes a base having a flat surface with an edge of a predetermined shape for abutting against a similar edge of another object. Conductors are placed on the flat surface of the base and extend to but do not overlap the edge of predetermined shape. The base along with a frame and a cover cooperate to provide a package which encloses and protects the semiconductor device. The package can be placed adjacent a similarly shaped package so that the overall structure takes up a minimal amount of space. Ground planes located on the base can be readily interconnected.

REFERENCES:
patent: 3651434 (1972-03-01), McGeough et al.
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4608592 (1986-08-01), Miyamoto
patent: 4768004 (1988-08-01), Wilson

Affiliated with

Also associated with

Rating

Coplanar waveguide semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Coplanar waveguide semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coplanar waveguide semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-943435