Method of making a multilayer printed wiring board

Details Method of making a multilayer printed wiring board Method of making a multilayer printed wiring board

1993-01-06

1994-08-16

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 156 89, 174261, 264 61, H05K 336

Patent

active

053374665

ABSTRACT:
The multilayer printed wiring board of this invention consists of a base substrate, a plurality of multilayer interconnections formed by lamination of metal wiring layer and insulation layer on the base substrate and ceramic substrates provided with through holes for electrical connection of the multilayer interconnections and inserted between two multilayer interconnections. The manufacturing method comprises lamination of metal wiring layers and insulation layers on both sides of ceramic substrates to form multilayer interconnections, forming of a multilayer interconnection on the base substrate by laminating a wiring layer and an insulation layer, and integration of the ceramic substrates with metal wiring layers and the base substrate placed together under heated and pressurized conditions.

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R. J. Jensen et al., "Copper/Polyimide Materials System For High Peformance Packaging," IEEE, 1984.

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