Semiconductor integrated circuit device and method of manufactur

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257393, 257903, H01L 2776, H01L 2711

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active

055980201

ABSTRACT:
A semiconductor integrated circuit device includes a first conductor formed on a main-surface of a semiconductor substrate with an insulating film therebetween, and a second conductor formed with an insulating film therebetween so as to be placed near one side of the first conductor and to have its one end extended over a top surface of the one side of the first conductor. The semiconductor integrated circuit device further includes an impurity diffusion layer at the main surface of the semiconductor substrate under a region where first and second conductors are close to each other. In accordance with this structure, higher degree of integration of a memory cell can be readily achieved by a relatively simple manufacturing process. Such a structure can be manufactured by forming the impurity diffusion layer at the surface of the semiconductor substrate, forming first conductor by patterning a first conductor layer, forming a second conductor layer, and forming a second conductor by patterning the second conductor layer.

REFERENCES:
patent: 5198691 (1993-03-01), Tarng
patent: 5319245 (1994-06-01), Chen et al.
patent: 5373192 (1994-12-01), Eguchi
"A high density SRAM cell using poly-Si pMOS FET", Yamanaka et al., ICD89-26, pp. 1-6.
"A 7.5-ns 32K .times. 8 CMOS SRAM", Hiroaki Okuyama et al., IEEE Journal of Solid-State Circuits, vol. 23, No. 5. Oct. 1988, pp. 1054-1058.

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